Team Group Also Announces Lightweight Mac Memory Module

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Team Group Inc. is going to release the new Team Mac SO-DIMM memory module at 2011 Computex Taipei. In order to provide enthusiasts with more diverse products, the Team Module series, which have garnered unbeatable public praise because of its excellent performance, will release for the first time the Team Mac memory module custom-made for Apple Mac notebook computers, developing a more professional and complete product line. Team Group Inc. employed its many years of accumulated technology research and development experience to break the space limits of notebook computers, using an extremely thin heat-sink design on the SO-DIMM modules that perfectly combines beautiful appearance with excellent performance. The feather lightweight Team Mac SO-DIMM memory module is the nova star of 2011 that will attract much attention.

Not only is the Team Mac SO-DIMM completely compatible with the Mac operating system, it has also passed Mac verifications, completely solving the troublesome compatibility problems for Mac users. Team Mac inherited Team Group’s standard persistence for quality, and uses memory particles rigorously selected and tested by Team Group to guarantee optimal and excellent operating performances. In addition, Team Group provides both single channel and dual channels for the Team Mac memory modules, with capacities ranging from 2GB~8GB (4G*2 kit) to satisfy users’ unlimited demand for upgrading.

The all new Team Mac SO-DIMM memory modules also break the mainstream rules by adopting heat-sinks on the SO-DIMM to protect the chip from being compromised. The heat skin can also help disperse heat more efficiently, providing a more stable operating environment. It uses aluminum to create a super lightweight case, which delicately compliments with the design of Mac Air/Pro. The Team Mac SO-DIMM are the first to lead memory modules into a new lightweight trend.